Find Your Next
Conference

The 30th Pacific-Asia Conference on Knowledge Discovery and Data Mining

IMX 2026 brings together researchers and practitioners working on interactive media experiences across human-computer interaction, multimedia engineering and design, media studies, psychology, and sociology.

QIP26 takes place in Växjö from June 9-12, 2026 and invites contributions on quantum foundations and applications including quantum information, probability, measurement theory, biology, cognition, decision making, and medicine.

Asia's largest AI event # Where AI meets the world The world's largest AI event 10-11 June 2026 Marina Bay Sands, Singapore

10-11 June 2026 | Tobacco Dock, London * 100+ SPONSORS & EXHIBITORS * IMMERSIVE AI EXPERIENCES * VIP PROGRAMME * CUTTING-EDGE AI DEMOS * 8 STAGES OF CONTENT * 4500+ ATTENDEES * 300+ SPEAKERS

PAI26 is scheduled for June 10–12, 2026 at Stanford, convening researchers and practitioners working at the intersection of physics and AI.

AIA26 brings architects and AEC professionals to San Diego for industry insights, keynotes, continuing education, architect-led tours, networking, and the AIA26 Expo.

The AHNA 46th Annual Conference theme is 'Holistic Nursing: Engaging Mother Nature's Wisdom. Global Wellness, Building a Holistic Future Together,' focused on nature connection, holistic nursing ethics, self-care, nutrition, and healing environments.

The 2026 forum brings together industry and academic experts on characterization and development of LNP vectors, with registration tiers for senior academy, industry, junior, and French Society of Biophysics members.

ITEC+ has served as IEEE's premier conference on transportation electrification, fostering connections between industry and academia.

#AMAC2026 features workshops, business matchmaking, airport and concessions programming, DBE/ACDBE and UCP training, and networking for aviation, airport, AEC, concessions, and compliance professionals.

The 2026 edition of the Hello Tomorrow Global Summit, focusing on deep tech innovations and challenges.